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RF Magnetron Sputtering System
RF Magnetron Sputtering System Specification
- Equipment Type
- RF Magnetron Sputtering System
- Material
- Stainless Steel, Aluminum, Borosilicate Glass
- Processing Type
- Physical Vapor Deposition (PVD)
- Condition
- New
- Technology
- Magnetron Sputtering
- Dimension (L*W*H)
- 1100 mm x 800 mm x 1500 mm
- Power Mode
- RF (Radio Frequency) Power
- Voltage
- 220-240V, 50/60Hz
- Power Consumption
- 800 W - 2 KW
- Pressure Output
- Base Vacuum < 1 x 10 torr, Working Pressure 1 x 10 to 1 x 10 torr
- Application
- Thin Film Deposition, Semiconductor Fabrication, Photovoltaic Research, Optical Coating
- Coating Type
- Metal, Oxide, Nitride, Alloy Films
- Accessories
- Target Holder, Substrate Holder, Vacuum Pump, Control Panel, Gas Flow Controller
- Safety Features
- Overpressure Protection, Interlock System
- Pump Type
- Rotary and Turbo Molecular Pump
- Operational Ambient Temperature
- 10C to 35C
- Gas Flow Control
- Mass Flow Controllers for Ar, O, N
- Cooling Method
- Water-Cooled Magnetron Guns
- Sputtering Rate
- 0.1-5 nm/sec (material dependent)
- Temperature Control
- Substrate Heater up to 500C
- RF Generator Frequency
- 13.56 MHz
- RF Power Control
- Adjustable up to 300W per Magnetron
- Chamber Material
- High Vacuum Grade Stainless Steel
- Substrate Size
- Up to 4 inches (100 mm)
- Number of Sputter Guns
- Up to 3 Magnetron Heads (custom configurable)
- Target Material Compatibility
- Metals, Oxides, Nitrides, Semiconductors
- System Control
- Automatic and Manual Modes
- Installation
- Floor Mounted
- Weight
- Approx 250 kg
- Display
- Digital Touchscreen Interface
RF Magnetron Sputtering System Trade Information
- Minimum Order Quantity
- 1 Piece
- Supply Ability
- 1 Piece Per Week
- Delivery Time
- 1 Week
- Main Domestic Market
- South India, Karnataka, Pondicherry, Tamil Nadu, Telangana, Kerala, Andhra Pradesh
About RF Magnetron Sputtering System
By keeping track with market development, we are indulged in manufacturing and supplying an exclusive collection of RF Magnetron Sputtering System which consists of cylindrical tube which creates plasma for coating different types of materials? These are manufactured by an experienced team of professionals, with in-depth knowledge about the latest trends prevailing in the industry. RF Magnetron Sputtering System can be used to deposit the films for a variety of applications, this system is accessible in different specifications as per the need of the clients scattered across the nation.
Custom-Configurable Magnetron Guns
The RF Magnetron Sputtering System supports up to three magnetron sputter guns, allowing operators to tailor the configuration for sequential or simultaneous depositions. This versatility enables efficient use in research or industrial settings where different material layers are required. Each gun is water-cooled for optimal thermal stability and performance during prolonged operation.
Advanced Substrate and Temperature Control
Accommodating substrates up to 4 inches (100 mm), the systems substrate heater provides accurate temperature management up to 500C. This capability is essential for producing high-quality thin films and supports diverse process requirements across various materials, from semiconductors to oxide coatings, ensuring reliable and repeatable results.
Comprehensive Safety and Automation
Equipped with features like overpressure protection and interlock systems, this machine ensures safe handling during use. Users benefit from both automatic and manual modes, enhancing usability for experimental setups or production runs. The digital touchscreen interface streamlines operation, offering real-time control and monitoring.
FAQs of RF Magnetron Sputtering System:
Q: How is substrate temperature controlled during the deposition process?
A: The system utilizes a substrate heater capable of reaching temperatures up to 500C, allowing precise control to suit a wide array of deposition requirements. Temperature can be adjusted and monitored via the digital touchscreen interface for optimal thin film quality.Q: What types of materials can be sputtered with this system?
A: This RF Magnetron Sputtering System is compatible with a comprehensive range of target materials including metals, oxides, nitrides, and semiconductors, making it suitable for diverse research and production applications.Q: Where is this equipment typically installed and used?
A: The system is floor-mounted and commonly installed in laboratories, semiconductor fabrication facilities, photovoltaic research centers, and institutions focusing on optical coating development. Its robust build and versatile capabilities make it ideal for demanding environments.Q: What is the process for controlling gas flow within the chamber?
A: Accurate gas flow control is achieved through integrated mass flow controllers for argon (Ar), oxygen (O), and nitrogen (N), enabling precise atmosphere adjustments to optimize sputtering conditions for each material type.Q: What safety features are included for user protection?
A: Safety is enhanced through overpressure protection and an interlock system, which automatically disables operation under unsafe conditions. These safeguards minimize risks while maintaining reliable functionality during thin film deposition.Q: What benefits does automatic and manual system control offer?
A: Automatic mode provides streamlined operation for repetitive tasks, ensuring consistency. Manual mode allows users to customize processes, making it valuable for R&D and specialized coating requirements, thus enhancing overall flexibility.Q: When should the adjustable RF power feature be utilized?
A: RF power can be adjusted up to 300W per magnetron to optimize deposition rates (0.15 nm/sec depending on material) and film quality, adapting the process for different materials and desired coating thicknesses.Tell us about your requirement
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Contact Details
THULIR VACUUM TECHNOLOGIES
GST : 33APQPR6798P1ZI
GST : 33APQPR6798P1ZI
No:28,4th Street, Poonamalle Road, Ekkatuthangal, Chennai - 600032, Tamil Nadu, India
Phone :08071930772
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